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Super Talent has developed a new line of green DDR3 modules that use 38% less PCB material and 47% less packaging material than the company’s standard DDR3 DIMMs. In that product line Super Talent has taken two major steps toward developing more eco-friendly DRAM. Using JEDEC standard schematics Super Talent developed very low profile (VLP) DDR3 unbuffered DIMMs for use in standard DDR3 based x86 motherboards. These DIMMs use 38% less FR4 material, which is the fiber glass epoxy substrate most

PCBs are made of, and one-third less copper.

Super Talent redesigned their package for these green DIMMs to use about half as much plastic in a clamshell that occupies 57% less volume. These reductions in material usage aftermath in a packaged module that weighs 35% less than a standard DDR3 packaged DIMM, which translates to significant savings in shipping costs. Super Talent’s first green 1066 and 1333 MHz 1GB and 2GB DIMMs will start shipping in September.

Original post by dhiram